Wafer dicing machine
Check category

Wafer dicing machine


The wafer robot arm takes the wafers out of the storage box and places the workpiece on the pre-alignment table. After the center is positioned, the direct-drive product carries the wafers and positions them at multiple angles. Send it to the worktable for cutting operations to achieve high-speed cutting.

Representative product model:

DD motor: DMFE170-045FE

Online customer service
Customer service hotline
18922305182 18922305182
Service time:
8:30 - 18:00
Customer service group:
Contact us

dzAddress: West Block, Laobing Building, No. 3012, Xingye Road, Xixiang Street, Baoan District, Shenzhen


sdTel:+86 189 2280 5132 

 Company Hotline:4009009819


All rights reserved©YOKOKAWA  粤ICP备15028162号  Powered by www.300.cn

Follow us: