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Wafer dicing machine
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Wafer dicing machine

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The wafer robot arm takes the wafers out of the storage box and places the workpiece on the pre-alignment table. After the center is positioned, the direct-drive product carries the wafers and positions them at multiple angles. Send it to the worktable for cutting operations to achieve high-speed cutting.

Representative product model:

DD motor: DMFE170-045FE

Online customer service
Customer service hotline
18922305182 18922305182
Service time:
8:30 - 18:00
Customer service group:
在线客服
Contact us

dzAddress: West Block, Laobing Building, No. 3012, Xingye Road, Xixiang Street, Baoan District, Shenzhen

yxE-mail:xingwubin@yokokawa.com.cn

sdTel:+86 189 2286 9561 Company hotline:4009009819

ewm

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