Wafer dicing machine
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Wafer dicing machine


The wafer robot arm takes the wafers out of the storage box and places the workpiece on the pre-alignment table. After the center is positioned, the direct-drive product carries the wafers and positions them at multiple angles. Send it to the worktable for cutting operations to achieve high-speed cutting.

Representative product model:

DD motor: DMFE170-045FE

Online customer service
Customer service hotline
0755-29121816 0755-29121816
Service time:
9:00 - 18:30
Customer service group:
Contact us

dzAddress: Factory Building B3, Block 25, Phase 1, Zone 3, Xin Xing Industrial Park, Xinhe Community, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province, China.



 Company Hotline:4009009819


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